Clad Metal
What is Clad?
Clad metal is composed of different kinds of metals bounded by cold rolling.
The boundary of two different materials is metallurgically combined by elemental diffusion. It differs from plating.
Clad metal enables quality improvements, lead-time reduction and the total cost down.
Features
- The boundary is strongly joined by elemental diffusion, so it will not be exfoliated.
- The metal layer can be thick, so it can be used for a high electric current.
- Multiple alloys can be joined.
- The features of combined materials are kept. (e.g. Conductivity and Strength, Weldability and thermal expansion)
- The hardness can be controlled
Others, Clad metal has a lot of possibility.
Applications
Resistors, Thermal protectors, Springs for printers, Connector shell, Connectors, Springs for keyboard, Shield cases, Surge absorbers, Power-window connectors, Battery parts, Membrane switches, Fire-alarm connectors, etc.
Our advantages
- Small lots
- Over-lay, In-lay
- Wide in-lay (wider than 50mm)。
Shapes of Clad
Available
Guide to metals for Cladding
| name | nominal composition(wt%) | Hardness(Hv) | electric conductivity (IACS%) |
Features |
|---|---|---|---|---|
| pure silver | 99.9Ag | 26 | 106 | for weak electric |
| silver-copper | 90Ag10Cu | 62 | 89 | strong contact pressure good for slider |
| 80Ag20Cu | 85 | 82 | ||
| silver-palladium | 70Ag30Pd | 70 | 11 | good oxidation resistance |
| 60Ag40Pd | 102 | 7.7 | ||
| silver-palladium-copper | 40Ag40Pd20Cu | 190 | 7.7 | worth 6 elemental alloy, good for slider |
| silver-nickel | 85Ag15Ni | 73 | 88 | better corrosion resistance than Ag, good welding resistance |
| silver solder （Bag8） | 72Ag28Cu | - | - | liquid’s temperature: 780℃ |
Guide to the base materials and cladding materials
| Name | Mark | Feature |
|---|---|---|
| Pure Copper | C1020 | High electric conductivity/high thermal conductivity |
| Phosphor Bronze | C5102 | High strength; used for sprigs |
| C5191 | ||
| C5212 | ||
| Yellow Brass | C2600 | Good workability; low price |
| C2680 | ||
| Pure Aluminum | A1050/A1100 | Light weight; high thermal conductivity |
| Pure Nickel | Ni | High corrosion resistance; strong magnetism |
| Pure Iron | SPCC | versatility; workability; low price |
| SUY | Deep drawability; electromagnetism | |
| Stainless Steel | SUS304 | High corrosion resistance; workability; used for springs |
| SUS430 | High corrosion resistance; low price; magnetism | |
| Fe-Ni alloy | 36Ni | Low-heat expansibility(mainly for shutting radio tube) |
| 42Ni | ||
| Fe-Ni-Co alloy | KOV | |
| Copper-Nickel | CN49 | Resistant alloys |
| Copper-Manganese | CM | |
| Nickel Chromium | NCH-1 |
Ni/SUS/Ni
【Ni/SUS301/Ni Ni/SUS304/Ni】
Ni clad metal is a diffusion bonding metal. It has both features of Ni and SUS301/SUS304. It is produced by a roll bonding process and a heat treatment.The features are follows. It is useful to changeover from Ni plating metal.
Bonding force
Ni is not exfoliated because it is a diffusion bonding metal.
Workability
Ni Clad Metal can be processed easily because of the soft Ni surface. It can prevent exfoliations and cracks by deep drawing or bending.
Wettability and Contact resistance
The value of wettability and contact resistance are the same as that of Ni plated metals.
Corrosion resistance
There is no pin hole which causes exfoliation, so the corrosion resistance is good.
Cost
Because our Ni Clad Metal is wider than Ni plating metals, cost can be lowered, especially when plating parts have to be changed.
Applications
It is used for connectors, shield cases, and other electrical parts.
Chemical Compositions(%)
| Metal grade | C | Cu | Fe | Mn | Ni | S | Si |
|---|---|---|---|---|---|---|---|
| Ni layer | ≦0.02 | ≦0.2 | ≦0.4 | ≦0.4 | ≧99.0 | ≦0.010 | ≦0.3 |
Specifications
| Thickness (mm) | 0.030~0.800 |
|---|---|
| Max. width (mm) | 300 |
| Finishing | As SUS301 or SUS304 |
| Ni surface | Both sides |
| Thickness of Ni | 1～3% of the whole thickness on each surface |
Physical properties
| Metal grade | Density (Mg/M3) |
Specific heat J/(kg・K) |
Electric resistance (μΩcm) |
Young’s modulus (N/mm2) |
Coefficient of thermal expansion (10-6/K) |
Thermal conductivity (W/(m・K)) |
|---|---|---|---|---|---|---|
| Ni/301/Ni | 7.97 | 500 | 69.4 | 193,600 | 16.8 | 19.3 |
| Ni/304/Ni | 7.94 | 500 | 69.4 | 193,600 | 17.1 | 19.3 |
Mechanical properties
Au SUS301, SUS304
Comparison with Ni plating (wettability and contact resistance)
Condition of diffusion-joining
Differences between Cladding and Plating
| Cladding | Plating | |
|---|---|---|
| 1. Combination of materials | ○ (Grate possibilities) | △ (Many restrictions) |
| 2. Bond strength of film | ◎ (Intermetallic bonding) | △ (Covalent bonding) |
| 3. Film thickness | ○ (1μm≦) | × (1～10μm) |
| 4. Control the hardness of film | Available | Difficult |
| 5. Alloy film | ◎ (Available) | × (Difficult) |
| 6. Film quality | ○ (Precise) | △ (Pin-holes) |
| 7. Price | △ (Comparatively high) | ○ (Comparatively low) |
